Invention Grant
- Patent Title: Method of manufacturing semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US10983584Application Date: 2004-11-09
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Publication No.: US07772052B2Publication Date: 2010-08-10
- Inventor: Shigenori Hayakawa
- Applicant: Shigenori Hayakawa
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Eric J. Robinson, Robinson Intellectual Property Law Office, P.C.
- Priority: JP2001-116208 20010413
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
There is provided a method of manufacturing a semiconductor device, in which removal of the resist after ion implantation becomes easy. In order to solve the above problem, the manufacturing method includes a step of removing a resist mask after a step of implanting an ion of a rare gas element. Also, another manufacturing method includes a first step of implanting an ion of an impurity element for imparting a conductivity type, a second step of implanting an ion of a rare gas element, and a third step of removing a resist mask after the first step and the second step.
Public/Granted literature
- US20050064685A1 Method of manufacturing semiconductor device Public/Granted day:2005-03-24
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