Invention Grant
- Patent Title: Integrated SiGe NMOS and PMOS transistors
- Patent Title (中): 集成SiGe NMOS和PMOS晶体管
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Application No.: US11761164Application Date: 2007-06-11
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Publication No.: US07772060B2Publication Date: 2010-08-10
- Inventor: Reiner Jumpertz , Klaus Schimpf
- Applicant: Reiner Jumpertz , Klaus Schimpf
- Applicant Address: DE Freising
- Assignee: Texas Instruments Deutschland GmbH
- Current Assignee: Texas Instruments Deutschland GmbH
- Current Assignee Address: DE Freising
- Agent Warren L. Franz; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Priority: DE102006028543 20060621
- Main IPC: H01L21/8238
- IPC: H01L21/8238

Abstract:
A method of fabricating an integrated BiCMOS circuit is provided, the circuit including bipolar transistors 10 and CMOS transistors 12 on a substrate. The method comprises the step of forming an epitaxial layer 28 to form a channel region of a MOS transistor and a base region of a bipolar transistor. Growing of the epitaxial layer includes growing a first sublayer of silicon 28a, a first sublayer of silicon-germanium 28b onto the first sublayer of silicon, a second sublayer of silicon 28c onto the first sublayer of silicon-germanium, and a second sublayer of silicon-germanium 28d onto the second sublayer of silicon. Furthermore, an integrated BiCMOS circuit is provided, which includes an epitaxial layer 28 as described above.
Public/Granted literature
- US20070298561A1 INTEGRATED SiGe NMOS AND PMOS TRANSISTORS Public/Granted day:2007-12-27
Information query
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