Invention Grant
US07772102B2 Nonvolatile semiconductor memory and fabrication method for the same
有权
非易失性半导体存储器及其制造方法相同
- Patent Title: Nonvolatile semiconductor memory and fabrication method for the same
- Patent Title (中): 非易失性半导体存储器及其制造方法相同
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Application No.: US12480383Application Date: 2009-06-08
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Publication No.: US07772102B2Publication Date: 2010-08-10
- Inventor: Yasuhiko Matsunaga
- Applicant: Yasuhiko Matsunaga
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-185616 20050624
- Main IPC: H01L21/3205
- IPC: H01L21/3205

Abstract:
A nonvolatile semiconductor memory that allows simultaneous implementation of high performance transistors in a low-voltage circuit region and transistors with high withstand voltages in a high-voltage circuit region. The nonvolatile semiconductor memory includes a cell array region that comprises aligned memory cell transistors, each including a control gate electrode, which includes a metal silicide film, an inter-gate insulating film below the control gate electrode, a floating gate electrode below the inter-gate insulating film, and a tunnel insulating film under the floating gate electrode; a high-voltage circuit region arranged in a periphery of the cell array region and including a high voltage transistor, which includes a first gate insulating film thicker than the tunnel insulating film; and a low-voltage circuit region that is arranged in a different position than the high-voltage circuit region arranged in the periphery of the cell array region and that includes a low-voltage transistor, which includes a gate electrode and a second gate insulating film thinner than the first gate insulating film below the gate electrode.
Public/Granted literature
- US20090239365A1 NONVOLATILE SEMICONDUCTOR MEMORY AND FABRICATION METHOD FOR THE SAME Public/Granted day:2009-09-24
Information query
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