Invention Grant
US07772595B2 Nitride semiconductor substrate, method for forming a nitride semiconductor layer and method for separating the nitride semiconductor layer from the substrate
有权
氮化物半导体衬底,用于形成氮化物半导体层的方法和用于从衬底分离氮化物半导体层的方法
- Patent Title: Nitride semiconductor substrate, method for forming a nitride semiconductor layer and method for separating the nitride semiconductor layer from the substrate
- Patent Title (中): 氮化物半导体衬底,用于形成氮化物半导体层的方法和用于从衬底分离氮化物半导体层的方法
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Application No.: US11554603Application Date: 2006-10-31
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Publication No.: US07772595B2Publication Date: 2010-08-10
- Inventor: Yih-Der Guo , Chih-Ming Lai , Jenq-Dar Tsay , Po-Chun Liu
- Applicant: Yih-Der Guo , Chih-Ming Lai , Jenq-Dar Tsay , Po-Chun Liu
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW95132153A 20060831
- Main IPC: H01L27/15
- IPC: H01L27/15

Abstract:
There is provided a method of forming a nitride semiconductor layer, including the steps of firstly providing a substrate on which a patterned epitaxy layer with a pier structure is formed. A protective layer is then formed on the patterned epitaxy layer, exposing a top surface of the pier structure. Next, a nitride semiconductor layer is formed over the patterned epitaxy layer connected to the nitride semiconductor layer through the pier structure, wherein the nitride semiconductor layer, the pier structure, and the patterned epitaxy layer together form a space exposing a bottom surface of the nitride semiconductor layer. Thereafter, a weakening process is performed to remove a portion of the bottom surface of the nitride semiconductor layer and to weaken a connection point between the top surface of the pier structure and the nitride semiconductor layer. Finally, the substrate is separated from the nitride semiconductor layer through the connection point.
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