Invention Grant
- Patent Title: Semiconductor device and method of manufacturing same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11849328Application Date: 2007-09-03
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Publication No.: US07772658B2Publication Date: 2010-08-10
- Inventor: Katsuyuki Uematsu , Shigeru Shinoda , Kimihiro Ashino
- Applicant: Katsuyuki Uematsu , Shigeru Shinoda , Kimihiro Ashino
- Applicant Address: JP
- Assignee: Fuji Electric Systems Co., Ltd.
- Current Assignee: Fuji Electric Systems Co., Ltd.
- Current Assignee Address: JP
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2006-238856 20060904
- Main IPC: H01L29/84
- IPC: H01L29/84

Abstract:
A lead frame which is disposed in an outer package is composed of three members. The lead frame is provided with contact electrodes, connector terminals, and conductive interconnections which are connected to the respective connector terminals. The arrangement order of the contact electrodes is such that contact electrodes are connected to the connector terminals, respectively; that is, the arrangement direction of the contact electrodes is the same as that of the connector terminals. On the other hand, the arrangement order of the contact electrodes is such that contact electrodes are connected to the connector terminals, respectively, that is, the arrangement direction of the contact electrodes is opposite to that of the connector terminals. Lead terminals of a resin cell package are connected to the contact electrodes.
Public/Granted literature
- US20080054384A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME Public/Granted day:2008-03-06
Information query
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