Invention Grant
- Patent Title: Semiconductor device with cooling member
- Patent Title (中): 带冷却元件的半导体器件
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Application No.: US11892808Application Date: 2007-08-27
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Publication No.: US07772692B2Publication Date: 2010-08-10
- Inventor: Tomonao Takamatsu , Hideo Aoki , Kazunari Ishimaru
- Applicant: Tomonao Takamatsu , Hideo Aoki , Kazunari Ishimaru
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2006-232747 20060829
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/26
Abstract:
A semiconductor device comprises: a semiconductor element; a mounting substrate with the semiconductor element mounted thereon; a first high thermal conductivity member formed on a surface of the mounting substrate; and a first cooling member thermally connected to at least a part of the first high thermal conductivity member. The first high thermal conductivity member is thermally connected to the semiconductor element, and the first high thermal conductivity member has an outer edge which is located outside an outer edge of the semiconductor element.
Public/Granted literature
- US20080067673A1 Semiconductor device Public/Granted day:2008-03-20
Information query
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