Invention Grant
- Patent Title: Panel, semiconductor device and method for the production thereof
- Patent Title (中): 面板，半导体器件及其制造方法
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Application No.: US11677774Application Date: 2007-02-22
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Publication No.: US07772693B2Publication Date: 2010-08-10
- Inventor: Adolf Koller , Horst Theuss , Ralf Otremba , Josef Hoeglauer , Helmut Strack , Reinhard Ploss
- Applicant: Adolf Koller , Horst Theuss , Ralf Otremba , Josef Hoeglauer , Helmut Strack , Reinhard Ploss
- Applicant Address: DE
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE
- Agency: Banner & Witcoff, Ltd.
- Priority: DE102007007142 20070209
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A panel has a baseplate with an upper first metallic layer and a multiplicity of a vertical semiconductor components. The vertical semiconductor components in each case have a first side with a first load electrode and a control electrode and an opposite second side with a second load electrode. The second side of the semiconductor components is in each case mounted on the metallic layer of the baseplate. The semiconductor components are arranged in such a way that edge sides of adjacent semiconductor components are separated from one another. A second metallic layer is arranged in separating regions between the semiconductor components.
Public/Granted literature
- US20080191359A1 Panel, semiconductor device and method for the production thereof Public/Granted day:2008-08-14
Information query
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