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US07772694B2 Integrated circuit module and method of packaging same 有权
集成电路模块及其封装方法

Integrated circuit module and method of packaging same
Abstract:
An integrated circuit (IC) module (20) includes a ground plane (22) having adjoining cutouts (30, 32). The cutout (32) defines a critical signal pathway (38). A device (24) is positioned in the cutout (30) and a device (26) is positioned outside of the cutout (30) adjacent to the cutout (32). An electrical interconnect (56) positioned in the critical signal pathway (38) interconnects the device (24) with the device (26). A method (60) of packaging the IC module (20) entails encapsulating the ground plane (22) and devices (24, 26) in a packaging material, and forming conductive vias (92) in the packaging material (84) that extend between the ground plane (22) and an exterior surface (94) of the packaging material (84). The conductive vias (92) surround the device (24) and cutout (32) to protect again electromagnetic interference and to provide guided signal pathways for high frequency signals on electrical interconnect (56).
Abstract(Chinese):

集成电路（IC）模块（20）包括具有相邻切口（30,32）的接地平面（22）。 切口（32）限定了临界信号通路（38）。 设备（24）位于切口（30）中，并且设备（26）位于与切口（32）相邻的切口（30）的外侧。 定位在关键信号路径（38）中的电互连（56）将设备（24）与设备（26）互连。 封装IC模块（20）的方法（60）需要将接地平面（22）和装置（24,26）封装在包装材料中，并且在包装材料（84）中形成导电通孔（92），其在 接地平面（22）和包装材料（84）的外表面（94）。 导电通孔（92）围绕设备（24）和切口（32），以再次保护电磁干扰并为电互连（56）上的高频信号提供引导信号通路。

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