Invention Grant
- Patent Title: Reprogrammable three dimensional intelligent system on a chip
- Patent Title (中): 可编程三维智能系统芯片
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Application No.: US12283452Application Date: 2008-09-12
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Publication No.: US07772880B2Publication Date: 2010-08-10
- Inventor: Neal Solomon
- Applicant: Neal Solomon
- Main IPC: H03K19/173
- IPC: H03K19/173
Abstract:
A high performance 3D semiconductor is described with cubic dimensional multi-node reprogrammable components for multi-functionality and intelligent behaviors. The system is modeled with dynamic EDA techniques. Applications of the intelligent SoC are specified, particularly embedded, multifunctional, DSP and high-performance computing applications.
Public/Granted literature
- US20090066366A1 Reprogrammable three dimensional intelligent system on a chip Public/Granted day:2009-03-12
Information query
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