Invention Grant
- Patent Title: Dielectric material
- Patent Title (中): 介电材料
-
Application No.: US10837411Application Date: 2004-04-30
-
Publication No.: US07773365B2Publication Date: 2010-08-10
- Inventor: Gregory S. Herman , Peter Mardilovich , Douglas Keszler , Jeremy Anderson
- Applicant: Gregory S. Herman , Peter Mardilovich , Douglas Keszler , Jeremy Anderson
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01G4/10
- IPC: H01G4/10 ; B05D1/26 ; B05D5/12
Abstract:
One embodiment of a dielectric material may include a metal containing cation and a polyatomic anion.
Public/Granted literature
- US20050242330A1 Dielectric material Public/Granted day:2005-11-03
Information query
