Invention Grant
- Patent Title: Power distribution system for integrated circuits
- Patent Title (中): 集成电路配电系统
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Application No.: US11757265Application Date: 2007-06-01
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Publication No.: US07773390B2Publication Date: 2010-08-10
- Inventor: Steve Weir , Scott McMorrow
- Applicant: Steve Weir , Scott McMorrow
- Applicant Address: US RI Narragansett
- Assignee: Teraspeed Consulting Group LLC
- Current Assignee: Teraspeed Consulting Group LLC
- Current Assignee Address: US RI Narragansett
- Agency: Stoel Rives LLP
- Main IPC: H05K1/14
- IPC: H05K1/14

Abstract:
A power distribution system for integrated circuits includes methods to damp resonance between a bypass capacitor network and a power/ground cavity of the printed circuit board that (a) does not require excessive quantities of bypass/damping components or (b) does not require high plane cavity capacitance or in the alternative can insure a Q of less than 1.4 at the transition from the bypass network to the plane cavity impedance cross-over.
Public/Granted literature
- US20070279881A1 POWER DISTRIBUTION SYSTEM FOR INTEGRATED CIRCUITS Public/Granted day:2007-12-06
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