Invention Grant
- Patent Title: Method and apparatus providing high density data storage
- Patent Title (中): 提供高密度数据存储的方法和装置
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Application No.: US11405637Application Date: 2006-04-18
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Publication No.: US07773492B2Publication Date: 2010-08-10
- Inventor: Jun Liu , Mike Violette , Gurtej Sandhu
- Applicant: Jun Liu , Mike Violette , Gurtej Sandhu
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dickstein Shapiro LLP
- Main IPC: G11B9/00
- IPC: G11B9/00
Abstract:
A data storage device and methods for storing and reading data are provided. The data storage device includes a data storage medium and second device. The data storage medium has an insulating layer, a first electrode layer over the insulating layer and at least one layer of resistance variable material over the first electrode layer. The second device includes a substrate and at least one conductive point configured to electrically contact the data storage medium.
Public/Granted literature
- US20070242500A1 Method and apparatus providing high density data storage Public/Granted day:2007-10-18
Information query
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