Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11365531Application Date: 2006-03-02
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Publication No.: US07773648B2Publication Date: 2010-08-10
- Inventor: Koichi Tachibana , Shinji Saito , Shinya Nunoue
- Applicant: Koichi Tachibana , Shinji Saito , Shinya Nunoue
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-204436 20050713
- Main IPC: H01S3/04
- IPC: H01S3/04 ; H01S5/00

Abstract:
Disclosed herein is a high-reliability semiconductor device. The laser diode includes: a substrate; a multi-layer film including a first conductivity type cladding layer provided on the substrate, a first conductivity type guide layer provided on the first conductivity type cladding layer, an active layer provided on the first conductivity type guide layer, a second conductivity type guide layer provided on the active layer, and a second conductivity type cladding layer provided on the second conductivity type guide layer, each of the layers being made of a nitride-based III-V group compound semiconductor; a first protective layer made of nitride and provided on a light emitting surface of the laser diode; and a second protective layer provided on the first protective layer and made of nitride having a refractive index different from that of the first protective layer.
Public/Granted literature
- US20070014323A1 Semiconductor device and method for manufacturing the same Public/Granted day:2007-01-18
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