Invention Grant
- Patent Title: Semiconductor integrated circuit device
- Patent Title (中): 半导体集成电路器件
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Application No.: US11586671Application Date: 2006-10-26
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Publication No.: US07774017B2Publication Date: 2010-08-10
- Inventor: Takahiro Irita , Kunihiko Nishiyama , Saneaki Tamaki , Takao Koike , Koji Goto , Masayuki Ito
- Applicant: Takahiro Irita , Kunihiko Nishiyama , Saneaki Tamaki , Takao Koike , Koji Goto , Masayuki Ito
- Applicant Address: JP Tokyo
- Assignee: Renesas Technology Corp.
- Current Assignee: Renesas Technology Corp.
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- Priority: JP2005-314135 20051028
- Main IPC: H04M1/00
- IPC: H04M1/00

Abstract:
A processing load of a high performance application processing such as a voice, an image and the like is reduced, and a processing capacity of a base band processing is improved. A semiconductor integrated circuit device used in a mobile communication system such as a cellular phone is provided with a base band CPU block performing a base band processing for executing a base band protocol stack, an application system CPU block executing a high-level OS and controlling applications other than the base band processing, an application real-time CPU block executing a real-time OS and the like and controlling an image/voice processing, all of which are formed on one semiconductor chip. Further, internal high-speed buses to which these CPU blocks are connected are respectively connected via bridges.
Public/Granted literature
- US20070098046A1 Semiconductor integrated circuit device Public/Granted day:2007-05-03
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