Invention Grant
- Patent Title: Multilayer conductive elements
- Patent Title (中): 多层导电元件
-
Application No.: US11684700Application Date: 2007-03-12
-
Publication No.: US07777397B2Publication Date: 2010-08-17
- Inventor: Vivek Bharti , Matthew J. Michel
- Applicant: Vivek Bharti , Matthew J. Michel
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Stephen L. Crooks
- Main IPC: H01L41/047
- IPC: H01L41/047 ; H01L41/22

Abstract:
An article comprises first and second electrically responsive elements having a cutting plane which is perpendicular to an x-dimension for separating the elements. The conductive elements of the conductive layers are alternatingly exposed to one of the two opposing faces of the conductive element.
Public/Granted literature
- US20080224566A1 MULTILAYER CONDUCTIVE ELEMENTS Public/Granted day:2008-09-18
Information query
IPC分类: