Invention Grant
- Patent Title: Heat dissipation device
- Patent Title (中): 散热装置
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Application No.: US11309354Application Date: 2006-07-31
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Publication No.: US07779894B2Publication Date: 2010-08-24
- Inventor: Jie-Bo Peng , Jin-Gong Meng , Ching-Bai Hwang , Jui-Wen Hung
- Applicant: Jie-Bo Peng , Jin-Gong Meng , Ching-Bai Hwang , Jui-Wen Hung
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Jeffrey T. Knapp
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A heat dissipation device includes a heat sink (10) and a blower (50) for generating an airflow to the heat sink. The blower includes a housing (60) and at least one plate (63a, 63b) extending outwardly from the housing. The housing forms a contacting surface (610, 620) abutting a side of the heat sink. The plate includes an inner surface (630) abutting another side of the heat sink. A groove (69) is defined in a junction of the housing and the plate, and thus the contacting surface of the housing and the inner surface of the plate are planar-shaped to avoid interference between the housing of the blower and the heat sink. The groove has chamfer angles R therein. The housing is made by plastic injection molding or die casting.
Public/Granted literature
- US20080023176A1 HEAT DISSIPATION DEVICE Public/Granted day:2008-01-31
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