Invention Grant
- Patent Title: System having primary and secondary backplanes
- Patent Title (中): 系统具有初级和次级背板
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Application No.: US11669860Application Date: 2007-01-31
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Publication No.: US07780455B2Publication Date: 2010-08-24
- Inventor: Kevin B. Leigh , David W. Sherrod , Kurt A. Manweiler
- Applicant: Kevin B. Leigh , David W. Sherrod , Kurt A. Manweiler
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A system comprises a primary backplane and a secondary backplane. The primary backplane has a surface region substantially devoid of components and a plurality of connectors to which electronic devices can be mated. The secondary backplane is removably mated to the primary backplane within the region. The secondary backplane has at least two connectors adapted to mate to at least two of the electronic devices. At least two electronic devices communicatively interconnect through the primary and secondary backplanes.
Public/Granted literature
- US20080180929A1 SYSTEM HAVING PRIMARY AND SECONDARY BACKPLANES Public/Granted day:2008-07-31
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