Invention Grant
US07780625B2 Instrument for implanting sensors and solid materials in a subcutaneous location and method thereof 有权
用于在皮下位置植入传感器和固体材料的仪器及其方法

  • Patent Title: Instrument for implanting sensors and solid materials in a subcutaneous location and method thereof
  • Patent Title (中): 用于在皮下位置植入传感器和固体材料的仪器及其方法
  • Application No.: US11345617
    Application Date: 2006-02-01
  • Publication No.: US07780625B2
    Publication Date: 2010-08-24
  • Inventor: Gust H. Bardy
  • Applicant: Gust H. Bardy
  • Agent Patrick J. S. Inouye
  • Main IPC: A61M31/00
  • IPC: A61M31/00
Instrument for implanting sensors and solid materials in a subcutaneous location and method thereof
Abstract:
An implantation instrument for implanting a substantially solid material, including solid medication or drugs, in a subcutaneous location and method are described. An incising shaft includes a beveled tip with a cutting edge along a distal end. A syringe body is affixed to a proximal end of the incising shaft. The syringe body and the incising shaft each define a substantially non-circular hollow bore extending continuously along a shared longitudinal axis. The incising shaft bore does not exceed the syringe body bore in girth. Both the incising shaft bore and the syringe body bore are sized to receive the solid material. A plunger is conformably shaped to the syringe body bore and has an end piece facilitating deployment of the plunger assembly. The plunger slidably fits within the syringe body bore and advances the solid material through the syringe body bore and the incising shaft bore into the subcutaneous location.
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