Invention Grant
- Patent Title: Intervertebral implantation apparatus
- Patent Title (中): 椎间植入装置
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Application No.: US11775303Application Date: 2007-07-10
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Publication No.: US07780676B2Publication Date: 2010-08-24
- Inventor: Ryan Cameron Lakin , Kirk J. Bailey , John M. Blumers
- Applicant: Ryan Cameron Lakin , Kirk J. Bailey , John M. Blumers
- Applicant Address: US NJ Parsippany
- Assignee: EBI, LLC
- Current Assignee: EBI, LLC
- Current Assignee Address: US NJ Parsippany
- Agency: Harness, Dickey
- Main IPC: A61B17/58
- IPC: A61B17/58 ; A61B17/60 ; A61F2/00

Abstract:
An implantation apparatus for preparing adjacent vertebral bodies to receive an intervertebral implant including a plurality of keels. The implantation apparatus includes an elongated handle portion, and a template portion carried at a distal end of the handle portion substantially perpendicularly to the handle portion. The template portion defines a plurality of open channels corresponding in position and shape of the plurality of keels. Each channel is positioned and shaped for preparing a vertebral opening to receive a corresponding keel.
Public/Granted literature
- US20080015702A1 INTERVERTEBRAL IMPLANTATION APPARATUS Public/Granted day:2008-01-17
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