Invention Grant
- Patent Title: Transparent heat shielding multilayer structure
- Patent Title (中): 透明隔热多层结构
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Application No.: US12189932Application Date: 2008-08-12
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Publication No.: US07781055B2Publication Date: 2010-08-24
- Inventor: Pao-Tang Chung , Sung-Jeng Jong , Jer-Young Chen , Yih-Her Chang
- Applicant: Pao-Tang Chung , Sung-Jeng Jong , Jer-Young Chen , Yih-Her Chang
- Applicant Address: TW
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW
- Agency: Lowe Hauptman Ham & Berner, LLP
- Priority: TW97119333A 20080526
- Main IPC: B32B5/16
- IPC: B32B5/16

Abstract:
A transparent heat shielding multilayer structure is disclosed. The multilayer structure includes: a transparent base film; a first transparent heat shielding layer with lanthanum hexaboride (LaB6) nanoparticles dispersed therein; and a second heat shielding layer with ATO (antimony doped tin oxide), ITO (indium tin oxide), or metal doped tungsten oxide nanoparticles dispersed therein. The first and second transparent heat shielding layers may be disposed on the same side or opposite sides of the transparent base film.
Public/Granted literature
- US20090291295A1 TRANSPARENT HEAT SHIELDING MULTILAYER STRUCTURE Public/Granted day:2009-11-26
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