Invention Grant
- Patent Title: Positive resist composition and resist pattern forming method
- Patent Title (中): 正抗蚀剂组合物和抗蚀剂图案形成方法
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Application No.: US11914509Application Date: 2006-04-18
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Publication No.: US07781144B2Publication Date: 2010-08-24
- Inventor: Yohei Kinoshita , Waki Ohkubo , Yusuke Nakagawa , Shinichi Hidesaka , Makiko Irie
- Applicant: Yohei Kinoshita , Waki Ohkubo , Yusuke Nakagawa , Shinichi Hidesaka , Makiko Irie
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP2005-143969 20050517
- International Application: PCT/JP2006/308124 WO 20060418
- International Announcement: WO2006/123496 WO 20061123
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; G03F7/30

Abstract:
The present invention is a positive resist composition and a resist pattern forming method including a resin component (A) which has a polymer compound (A1) having a structural units (a1) including an acetal type acid dissociable, dissolution inhibiting group, a structural unit (a2) derived from an acrylate ester having a lactone-containing polycyclic group, and a structural unit (a3) derived from an acrylate ester having a polar group-containing aliphatic hydrocarbon group, and an acid generator component (B) having an onium salt-based acid generator (B1) having a cation portion represented by a general formula (b-1) shown below [wherein, R11 represents an alkyl group, an alkoxy group, a halogen atom or a hydroxyl group; R12 to R13 each represents, independently, an aryl group or the alkyl group that may have substituent group; n′ represents either 0 or an integer from 1 to 3].
Public/Granted literature
- US20090035698A1 POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD Public/Granted day:2009-02-05
Information query
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