Invention Grant
US07781231B2 Method of forming a magnetic tunnel junction device 有权
形成磁隧道结装置的方法

  • Patent Title: Method of forming a magnetic tunnel junction device
  • Patent Title (中): 形成磁隧道结装置的方法
  • Application No.: US12044596
    Application Date: 2008-03-07
  • Publication No.: US07781231B2
    Publication Date: 2010-08-24
  • Inventor: Xia Li
  • Applicant: Xia Li
  • Applicant Address: US CA San Diego
  • Assignee: QUALCOMM Incorporated
  • Current Assignee: QUALCOMM Incorporated
  • Current Assignee Address: US CA San Diego
  • Agent Nicholas J. Pauley; Sam Talpalatsky; Peter Kamarchik
  • Main IPC: H01L21/00
  • IPC: H01L21/00
Method of forming a magnetic tunnel junction device
Abstract:
A method of manufacturing a magnetic tunnel junction device is disclosed that includes forming a trench in a substrate, depositing a conductive terminal within the trench, and depositing a magnetic tunnel junction (MTJ) structure within the trench. The MTJ structure includes a fixed magnetic layer having a fixed magnetic orientation, a tunnel junction layer, and a free magnetic layer having a configurable magnetic orientation. The fixed magnetic layer is coupled to the conductive terminal along an interface that extends substantially normal to a surface of the substrate. The free magnetic layer that is adjacent to the conductive terminal carries a magnetic domain adapted to store a digital value.
Public/Granted literature
Information query
Patent Agency Ranking
0/0