Invention Grant
- Patent Title: Method of forming a magnetic tunnel junction device
- Patent Title (中): 形成磁隧道结装置的方法
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Application No.: US12044596Application Date: 2008-03-07
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Publication No.: US07781231B2Publication Date: 2010-08-24
- Inventor: Xia Li
- Applicant: Xia Li
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Nicholas J. Pauley; Sam Talpalatsky; Peter Kamarchik
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method of manufacturing a magnetic tunnel junction device is disclosed that includes forming a trench in a substrate, depositing a conductive terminal within the trench, and depositing a magnetic tunnel junction (MTJ) structure within the trench. The MTJ structure includes a fixed magnetic layer having a fixed magnetic orientation, a tunnel junction layer, and a free magnetic layer having a configurable magnetic orientation. The fixed magnetic layer is coupled to the conductive terminal along an interface that extends substantially normal to a surface of the substrate. The free magnetic layer that is adjacent to the conductive terminal carries a magnetic domain adapted to store a digital value.
Public/Granted literature
- US20090224341A1 Method of Forming a Magnetic Tunnel Junction Device Public/Granted day:2009-09-10
Information query
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