Invention Grant
- Patent Title: Integrated circuit device
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Application No.: US11588439Application Date: 2006-10-26
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Publication No.: US07781240B2Publication Date: 2010-08-24
- Inventor: Avner Badehi
- Applicant: Avner Badehi
- Applicant Address: HU
- Assignee: Tessera Technologies Hungary Kft.
- Current Assignee: Tessera Technologies Hungary Kft.
- Current Assignee Address: HU
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: IL123207 19980206
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
An integrally packaged optronic integrated circuit device (310) including an integrated circuit die (322) containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mechanically protective material, at least one of the surfaces (317) being transparent to radiation, and electrically insulative edge surfaces (314) having pads.
Public/Granted literature
- US20070042562A1 Integrated circuit device Public/Granted day:2007-02-22
Information query
IPC分类: