Invention Grant
US07781266B2 Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
失效
用于改进引线框集成电路（IC）封装中的热性能和电磁干扰（EMI）屏蔽的方法和装置
- Patent Title: Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
- Patent Title (中): 用于改进引线框集成电路（IC）封装中的热性能和电磁干扰（EMI）屏蔽的方法和装置
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Application No.: US12535548Application Date: 2009-08-04
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Publication No.: US07781266B2Publication Date: 2010-08-24
- Inventor: Sam Ziqun Zhao , Reza-ur Rahman Khan
- Applicant: Sam Ziqun Zhao , Reza-ur Rahman Khan
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox, PLLC.
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L21/56 ; H01L21/58
Abstract:
A method of assembling an IC device package is provided. A leadframe is formed. At least one IC die is attached to a die attach pad portion of the leadframe. Wire bonds are coupled between the IC die and the leadframe. A cap is attached to the leadframe. A second surface of the cap includes a cavity formed therein. The cap and leadframe form an enclosure structure that substantially encloses the at least one IC die. An encapsulating material is applied to encapsulate at least the IC die. A perimeter support ring portion of the leadframe is trimmed.
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