Invention Grant
- Patent Title: Mesoporous silica thick-film, process for producing the same, adsorption apparatus and adsorbing film
- Patent Title (中): 介孔二氧化硅厚膜，其制备方法，吸附装置和吸附膜
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Application No.: US11918894Application Date: 2006-04-20
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Publication No.: US07781369B2Publication Date: 2010-08-24
- Inventor: Hideyuki Negishi , Akira Endo , Masaru Nakaiwa , Hiroshi Yanagishita
- Applicant: Hideyuki Negishi , Akira Endo , Masaru Nakaiwa , Hiroshi Yanagishita
- Applicant Address: JP Tokyo
- Assignee: National Institute of Advanced Industrial Science and Technology
- Current Assignee: National Institute of Advanced Industrial Science and Technology
- Current Assignee Address: JP Tokyo
- Agency: Morgan, Lewis & Bockius LLP
- Priority: JP2005-122591 20050420
- International Application: PCT/JP2006/308336 WO 20060420
- International Announcement: WO2006/112505 WO 20061026
- Main IPC: B01J20/10
- IPC: B01J20/10 ; C01B33/12
Abstract:
A mesoporous silica thick-film comprising a layer of mesoporous silica formed in a thickness of 10 μm to 1 mm, and a process for producing a mesoporous silica thick-film, which comprises disposing a substrate in a solution containing mesoporous silica suspended therein and subsequently applying a voltage thereby to form a film having a thickness of 10 μm to 1 mm by the electrophoretic deposition of the mesoporous silica on a surface of the substrate is provided.
Public/Granted literature
- US20090082201A1 Mesoporous silica thick-film, process for producing the same, absorption apparatus and adsorbing film Public/Granted day:2009-03-26
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