Invention Grant
- Patent Title: Solubilizer and composition containing same
- Patent Title (中): 增溶剂及含有它的组合物
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Application No.: US10592123Application Date: 2005-03-09
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Publication No.: US07781519B2Publication Date: 2010-08-24
- Inventor: Rumi Ueda , Naoki Hayashi , Yutaka Kobayashi , Tomomi Ujiie , Hiroki Katono
- Applicant: Rumi Ueda , Naoki Hayashi , Yutaka Kobayashi , Tomomi Ujiie , Hiroki Katono
- Applicant Address: JP Tokyo
- Assignee: Kureha Corporation
- Current Assignee: Kureha Corporation
- Current Assignee Address: JP Tokyo
- Agency: Reed Smith LLP
- Priority: JP2004-068005 20040310
- International Application: PCT/JP2005/004117 WO 20050309
- International Announcement: WO2005/087870 WO 20050922
- Main IPC: C08K5/49
- IPC: C08K5/49 ; C08K5/06

Abstract:
The present invention provides a solubilizing agent that can give solubility or dispersibility in resins to copper-containing phosphorus compounds, and a composition containing the solubilizing agent. The solubilizing agent of the invention comprises a compound represented by the following general formula (100) having a main chain with an oxyalkylene unit. [wherein R111 represents hydrogen or a b-valent organic group, R112 represents C2-4 alkylene, R113 represents hydrogen, alkyl, aryl or acyl, a represents an integer of 1-50 and b represents an integer of 1-4.]
Public/Granted literature
- US20070244221A1 Solubilizer and Composition Containing Same Public/Granted day:2007-10-18
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