Invention Grant
- Patent Title: Releasing composition
- Patent Title (中): 释放组合物
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Application No.: US11743445Application Date: 2007-05-02
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Publication No.: US07781524B2Publication Date: 2010-08-24
- Inventor: Takuya Monju
- Applicant: Takuya Monju
- Applicant Address: JP Tokyo
- Assignee: Sony Chemical & Information Device Corporation
- Current Assignee: Sony Chemical & Information Device Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JP2003-203547 20030730
- Main IPC: C08F8/00
- IPC: C08F8/00 ; C08L83/00 ; B41M5/40

Abstract:
A releasing composition capable of improving abrasion resistance includes a releasing composition containing releasing particles in a film forming material, and the releasing particle has a first releasing resin as a core material and a second releasing resin as a coating material. The first releasing resin has a relatively higher releasing property than the second releasing resin. The first releasing resin can include a surface tension of from about 0.01 N/m to about 0.025 N/m, and the second releasing resin may have a surface tension of from about 0.026 N/m to about 0.05 N/m.
Public/Granted literature
- US20070224372A1 RELEASING COMPOSITION Public/Granted day:2007-09-27
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