Invention Grant
US07781526B2 Medical implant or medical implant part comprising porous UHMWPE and process for producing the same
有权
包含多孔UHMWPE的医用植入物或医用植入物部件及其制造方法
- Patent Title: Medical implant or medical implant part comprising porous UHMWPE and process for producing the same
- Patent Title (中): 包含多孔UHMWPE的医用植入物或医用植入物部件及其制造方法
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Application No.: US11765716Application Date: 2007-06-20
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Publication No.: US07781526B2Publication Date: 2010-08-24
- Inventor: Richard S. King , Mark D. Hanes
- Applicant: Richard S. King , Mark D. Hanes
- Applicant Address: US IN Warsaw
- Assignee: DePuy Products, Inc.
- Current Assignee: DePuy Products, Inc.
- Current Assignee Address: US IN Warsaw
- Agency: Leydig, Voit & Mayer, Ltd.
- Main IPC: C08F110/02
- IPC: C08F110/02 ; C08F20/06 ; C08F118/02 ; C08F8/00 ; C08F283/00 ; C08L31/00 ; C08L33/02 ; C08L29/00
Abstract:
The invention provides a medical implant or medical implant part comprising porous ultrahigh molecular weight polyethylene having a weight average molecular weight of about 400,000 atomic mass units or more and a porosity of about 15% to about 65%. The invention further provides a process for producing a medical implant or medical implant part.
Public/Granted literature
- US20080033573A1 MEDICAL IMPLANT OR MEDICAL IMPLANT PART COMPRISING POROUS UHMWPE AND PROCESS FOR PRODUCING THE SAME Public/Granted day:2008-02-07
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