Invention Grant
- Patent Title: Curable composition and method for producing the same
- Patent Title (中): 可固化组合物及其制造方法
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Application No.: US10566477Application Date: 2004-07-30
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Publication No.: US07781559B2Publication Date: 2010-08-24
- Inventor: Atsushi Saito , Tomonori Saito , Naomi Okamura
- Applicant: Atsushi Saito , Tomonori Saito , Naomi Okamura
- Applicant Address: JP Shinagawa-ku, Tokyo
- Assignee: Cemedine Co., Ltd.
- Current Assignee: Cemedine Co., Ltd.
- Current Assignee Address: JP Shinagawa-ku, Tokyo
- Agency: McGlew and Tuttle, P.C.
- Priority: JP2003-285322 20030801; JP2003-311808 20030903
- International Application: PCT/JP2004/010909 WO 20040730
- International Announcement: WO2005/012426 WO 20050210
- Main IPC: C08G77/20
- IPC: C08G77/20

Abstract:
Disclosed herein is a curable composition excellent in workability, adhesion properties, rubber-like properties, storage stability, and quick curability. The curable composition comprises (A) a crosslinkable silyl group-containing organic polymer and (B) a (meth)acrylic polymer obtained by polymerizing a (meth)acrylic monomer having a polymerizable unsaturated bond in the presence of a metallocene compound and a crosslinkable silyl group-containing thiol compound, at least one end of the (meth)acrylic polymer being bonded to a residue, —S—R3 (where R3 represents a group having a crosslinkable silyl group) obtained by removing a hydrogen atom from the crosslinkable silyl group-containing thiol compound.
Public/Granted literature
- US20060293456A1 Curable composition and method for producing the same Public/Granted day:2006-12-28
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