The invention concerns an organic photovoltaic component with a novel encapsulation, wherein the invention for the first time discloses packaging for organic solar cells that includes a low-cost film composite comprising a metal portion. The packaging meets high requirements, particularly with respect to high barrier properties against oxygen and water vapor encapsulation without or with only minimal adhesive joints, since the encapsulation can be welded/soldered to the substrate or the bottom electrode, integrated lead-through of electrical connections, including adhesive-bonded, soldered and/or welded connections.