Invention Grant
- Patent Title: Flexible printed circuit board
- Patent Title (中): 柔性印刷电路板
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Application No.: US11951290Application Date: 2007-12-05
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Publication No.: US07781680B2Publication Date: 2010-08-24
- Inventor: Yu-Chang Pai , Shou-Kuo Hsu , Chien-Hung Liu
- Applicant: Yu-Chang Pai , Shou-Kuo Hsu , Chien-Hung Liu
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200710201819 20070921
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
An exemplary FPCB includes a differential pair consisting of a first transmission line and a second transmission line, a signal layer with the first transmission line arranged therein, a ground layer having a void which includes the area beneath the first transmission line, and a dielectric layer lying between the signal layer and the ground layer. The second transmission line is arranged in the ground layer offset from the first transmission line in the horizontal direction. The FPCB can transmit high speed signals.
Public/Granted literature
- US20090078452A1 FLEXIBLE PRINTED CIRCUIT BOARD Public/Granted day:2009-03-26
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