Invention Grant
- Patent Title: Assembly for a microstimulator
- Patent Title (中): 组装微型激励器
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Application No.: US12027533Application Date: 2008-02-07
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Publication No.: US07781683B2Publication Date: 2010-08-24
- Inventor: Matthew I. Haller , Tom Xiahoai He , Jay Daulton
- Applicant: Matthew I. Haller , Tom Xiahoai He , Jay Daulton
- Applicant Address: US CA Valencia
- Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee Address: US CA Valencia
- Agency: Wong, Cabello, Lutsch, Rutherford & Brucculeri, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
An electrode assembly includes an electrode electrically connected to a capacitor with a wire. An assembly carrier may be used to hold and secure at least the wire and capacitor during assembly. A method of assembly for attaching a wire to a capacitor and an electrode may include an assembly carrier for housing and securing the wire, capacitor, and electrode during assembly.
Public/Granted literature
- US20080121419A1 ASSEMBLY FOR A MICROSTIMULATOR Public/Granted day:2008-05-29
Information query
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