Invention Grant
- Patent Title: Active device array substrate and method for fabricating the same
- Patent Title (中): 有源器件阵列衬底及其制造方法
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Application No.: US12190887Application Date: 2008-08-13
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Publication No.: US07781776B2Publication Date: 2010-08-24
- Inventor: Kuo-Lung Fang , Hsiang-Lin Lin , Han-Tu Lin
- Applicant: Kuo-Lung Fang , Hsiang-Lin Lin , Han-Tu Lin
- Applicant Address: TW Hsinchu
- Assignee: AU Optronics Corp.
- Current Assignee: AU Optronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Priority: TW97113250A 20080411
- Main IPC: H01L21/30
- IPC: H01L21/30

Abstract:
An active device array substrate and its fabricating method are provided. According to the subject invention, the elements of an array substrate such as the thin film transistors, gate lines, gate pads, data lines, data pads and storage electrodes, are provided by forming a patterned first metal layer, an insulating layer, a patterned semiconductor layer and a patterned metal multilayer. Furthermore, the subject invention uses the means of selectively etching certain layers. Using the aforesaid means, the array substrate of the subject invention has some layers with under-cut structures, and thus, the number of the time-consuming and complicated mask etching process involved in the production of an array substrate can be reduced. The subject invention provides a relatively simple and time-saving method for producing an array substrate.
Public/Granted literature
- US20090256164A1 Active Device Array Substrate and Method for Fabricating the Same Public/Granted day:2009-10-15
Information query
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