Invention Grant
- Patent Title: Light emitting device package having a transparent cover
- Patent Title (中): 具有透明盖的发光器件封装
-
Application No.: US11495764Application Date: 2006-07-31
-
Publication No.: US07781788B2Publication Date: 2010-08-24
- Inventor: Arthur Darbinian , Seung Tae Choi , Ki Hwan Kwon , Chang Youl Moon , Kyu Ho Shin
- Applicant: Arthur Darbinian , Seung Tae Choi , Ki Hwan Kwon , Chang Youl Moon , Kyu Ho Shin
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2005-0130950 20051227
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A light emitting device package including a transparent cover having an electrode pattern formed on a bottom surface thereof; a light emitting device installed below the transparent cover and electrically connected to an external circuit via the electrode pattern; a fixing resin which fixes the light emitting device onto the bottom surface of the transparent cover; and a metal slug provided under the fixing resin to dissipate heat away from the light emitting device.
Public/Granted literature
- US20070145393A1 Light emitting device package and method of manufacturing the same Public/Granted day:2007-06-28
Information query
IPC分类:
