Invention Grant
- Patent Title: Solid-state image pickup device and fabrication method therefor
- Patent Title (中): 固态摄像装置及其制造方法
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Application No.: US12334229Application Date: 2008-12-12
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Publication No.: US07781798B2Publication Date: 2010-08-24
- Inventor: Yusaku Kobayashi , Koji Watanabe , Toshihiko Hayashi
- Applicant: Yusaku Kobayashi , Koji Watanabe , Toshihiko Hayashi
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rockey, Depke & Lyons
- Agent Robert J. Depke
- Priority: JP2008-007730 20080117; JP2008-231782 20080910
- Main IPC: H01L31/0328
- IPC: H01L31/0328
Abstract:
Disclosed herein is a solid-state image pickup device, including, a light receiving pixel section, a black level reference pixel section, a multi-layer wiring line section, a first light blocking film, a second light blocking film, a third light blocking film, and a fourth light blocking layer.
Public/Granted literature
- US20090184386A1 SOLID-STATE IMAGE PICKUP DEVICE AND FABRICATION METHOD THEREFOR Public/Granted day:2009-07-23
Information query
IPC分类:
