Invention Grant
US07781805B2 Memory with high dielectric constant antifuses adapted for use at low voltage
有权
具有适用于低电压使用的高介电常数反熔丝的存储器
- Patent Title: Memory with high dielectric constant antifuses adapted for use at low voltage
- Patent Title (中): 具有适用于低电压使用的高介电常数反熔丝的存储器
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Application No.: US12367214Application Date: 2009-02-06
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Publication No.: US07781805B2Publication Date: 2010-08-24
- Inventor: Xiaoyu Yang , Roy E. Scheurelein , Feng Li , Albert T. Meeks
- Applicant: Xiaoyu Yang , Roy E. Scheurelein , Feng Li , Albert T. Meeks
- Applicant Address: US CA Milpitas
- Assignee: SanDisk 3D LLC
- Current Assignee: SanDisk 3D LLC
- Current Assignee Address: US CA Milpitas
- Agency: Dugan & Dugan, PC
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A memory array having memory cells comprising a diode and an antifuse can be made smaller and programmed at lower voltage by using an antifuse material having a higher dielectric constant and a higher acceleration factor than those of silicon dioxide, and by using a diode having a lower band gap than that of silicon. Such memory arrays can be made to have long operating lifetimes by using the high acceleration factor and lower band gap materials. Antifuse materials having dielectric constants between 5 and 27, for example, hafnium silicon oxynitride or hafnium silicon oxide, are particularly effective. Diode materials with band gaps lower than that of silicon, such as germanium or a silicon-germanium alloy, are particularly effective.
Public/Granted literature
- US20090140299A1 MEMORY WITH HIGH DIELECTRIC CONSTANT ANTIFUSES ADAPTED FOR USE AT LOW VOLTAGE Public/Granted day:2009-06-04
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