Invention Grant
- Patent Title: High voltage depletion layer field effect transistor
- Patent Title (中): 高电压耗尽层场效应晶体管
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Application No.: US11578018Application Date: 2005-04-06
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Publication No.: US07781809B2Publication Date: 2010-08-24
- Inventor: Martin Knaipp
- Applicant: Martin Knaipp
- Applicant Address: AT Premstätten
- Assignee: Austriamicrosystems AG
- Current Assignee: Austriamicrosystems AG
- Current Assignee Address: AT Premstätten
- Agency: Cohen Pontani Lieberman & Pavane LLP
- Priority: DE102004018153 20040408
- International Application: PCT/EP2005/003623 WO 20050406
- International Announcement: WO2005/098964 WO 20051020
- Main IPC: H01L21/337
- IPC: H01L21/337 ; H01L27/088

Abstract:
In a high voltage junction field effect transistor, a first well (11) of a first conductivity type is formed in a substrate (10) of a second conductivity type. A source (14) and a drain (15) which are each of the first conductivity type are formed in the first well. A gate (16) of the second conductivity type is arranged in a second well (12) of the second conductivity type, wherein the second well is of the retrograde type. The source, gate and drain are spaced apart from one another by field oxide regions (13a to 13d). Field plates (17a, 17b) extend over the field oxide (13a, 13b) from the gate (16) in the direction of source and drain.
Public/Granted literature
- US20080067560A1 High Voltage Depletion Layer Field Effect Transistor Public/Granted day:2008-03-20
Information query
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