Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11962150Application Date: 2007-12-21
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Publication No.: US07781825B2Publication Date: 2010-08-24
- Inventor: Erh-Kun Lai , Hang-Ting Lue
- Applicant: Erh-Kun Lai , Hang-Ting Lue
- Applicant Address: TW Hsinchu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/792

Abstract:
A semiconductor device includes an insulating layer, a channel structure, an insulating structure and a gate. The channel structure includes a channel bridge for connecting two platforms. The bottom of the channel bridge is separated from the insulating layer by a distance, and the channel bridge has a plurality of separated doping regions. The insulating structure wraps around the channel bridge, and the gate wraps around the insulating structure.
Public/Granted literature
- US20090101967A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2009-04-23
Information query
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