An integrated semiconductor with lateral thermal insulation is disclosed. In one embodiment, the chip has, on a common substrate, at least one power semiconductor circuit region and, laterally adjacent to the power semiconductor circuit region, at least one further temperature-sensitive semiconductor circuit region, interspaces being maintained between the circuit regions. At least one thermally insulating trench is provided at least in each interspace in each case between power semiconductor circuit region(s) and temperature-sensitive semiconductor circuit region(s), which at least one thermally insulating trench extends into the depth of the chip right into the substrate and in the longitudinal direction of the chip at least over a lateral side of the at least one power semiconductor circuit region and/or the temperature-sensitive semiconductor circuit region and is either unfilled or filled with a thermally insulating filling material.