Invention Grant
- Patent Title: Semiconductor device having recessed channel and method for manufacturing the same
- Patent Title (中): 具有凹槽的半导体器件及其制造方法
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Application No.: US12121637Application Date: 2008-05-15
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Publication No.: US07781829B2Publication Date: 2010-08-24
- Inventor: Jin Yul Lee
- Applicant: Jin Yul Lee
- Applicant Address: KR Icheon-si
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Marshall, Gerstein & Borun LLP
- Priority: KR10-2007-0127859 20071210
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119

Abstract:
A semiconductor device having a recessed channel and a method for manufacturing the same. The semiconductor device comprises a semiconductor substrate formed with an isolation layer defining an active region including a channel region and a junction region, a recessed trench including a top trench formed within the channel region of the semiconductor substrate and a bottom trench formed from a bottom surface of the top trench with a width narrower than the top trench, and a gate stack overlapping the recessed trench and extending across the active region.
Public/Granted literature
- US20090146243A1 Semiconductor Device Having Recessed Channel and Method for Manufacturing the Same Public/Granted day:2009-06-11
Information query
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