Invention Grant
- Patent Title: Robust ESD LDMOS device
- Patent Title (中): 坚固的ESD LDMOS器件
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Application No.: US11773364Application Date: 2007-07-03
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Publication No.: US07781834B2Publication Date: 2010-08-24
- Inventor: Chi-San Wei , Kuo-Ming Wu , Jian-Hsing Lee
- Applicant: Chi-San Wei , Kuo-Ming Wu , Jian-Hsing Lee
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/10

Abstract:
A semiconductor device includes a gate electrode over a semiconductor substrate, wherein the gate electrode has a gate width direction; a source/drain region in the semiconductor substrate and adjacent the gate electrode, wherein the source/drain region has a first width in a direction parallel to the gate width direction; and a bulk pick-up region in the semiconductor substrate and abutting the source/drain region. The bulk pick-up region and the source/drain region have opposite conductivity types. The bulk pick-up region has a second width in the width direction, and wherein the second width is substantially less than the first width.
Public/Granted literature
- US20090008710A1 Robust ESD LDMOS Device Public/Granted day:2009-01-08
Information query
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