Invention Grant
- Patent Title: Integrated circuit including a body transistor and method
- Patent Title (中): 集成电路,包括体晶体管和方法
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Application No.: US12106456Application Date: 2008-04-21
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Publication No.: US07781838B2Publication Date: 2010-08-24
- Inventor: Dongping Wu
- Applicant: Dongping Wu
- Applicant Address: DE Munich
- Assignee: Qimonda AG
- Current Assignee: Qimonda AG
- Current Assignee Address: DE Munich
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L27/01
- IPC: H01L27/01

Abstract:
An integrated circuit including a floating body transistor and method. One embodiment provides a transistor including a body region formed in a first portion and a first and a second source/drain region formed in a second and a third portion. The body region is formed in a semiconductor substrate. The integrated circuit further includes a buried structure disposed at least below the body region and a first and a second insulating structure including an insulating material and being disposed at least between the body region and regions of the second and the third portion below the first and the second source drain region, wherein the first and the second insulating structure contact the buried structure.
Public/Granted literature
- US20090261411A1 INTEGRATED CIRCUIT INCLUDING A BODY TRANSISTOR AND METHOD Public/Granted day:2009-10-22
Information query
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