Invention Grant
- Patent Title: Semiconductor device and method for producing it
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12112624Application Date: 2008-04-30
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Publication No.: US07781842B2Publication Date: 2010-08-24
- Inventor: Franz Hirler , Elmar Falck , Hans-Joachim Schulze
- Applicant: Franz Hirler , Elmar Falck , Hans-Joachim Schulze
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102007020659 20070430
- Main IPC: H01L27/07
- IPC: H01L27/07 ; H01L29/08

Abstract:
A semiconductor device which has a semiconductor body and a method for producing it. At the semiconductor body, a first electrode which is electrically connected to a first near-surface zone of the semiconductor body and a second electrode which is electrically connected to a second zone of the semiconductor body are arranged. A drift section is arranged between the first and the second electrode. In the drift section, a coupling structure is provided for at least one field plate arranged in the drift section. The coupling structure has a floating first area doped complementarily to the drift section and a second area arranged in the first area. The second area forms a locally limited punch-through effect or an ohmic contact to the drift section, and the field plate is electrically connected at least to the second area.
Public/Granted literature
- US20080265329A1 SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING IT Public/Granted day:2008-10-30
Information query
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