Invention Grant
- Patent Title: Semiconductor device having a stressor film
- Patent Title (中): 具有应力膜的半导体器件
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Application No.: US11907319Application Date: 2007-10-11
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Publication No.: US07781844B2Publication Date: 2010-08-24
- Inventor: Shinji Takeoka
- Applicant: Shinji Takeoka
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-323674 20061130
- Main IPC: H01L23/62
- IPC: H01L23/62

Abstract:
A first NMIS transistor includes: a first gate dielectric film over the first active region; a first gate electrode on the first gate dielectric film; a first side-wall dielectric film on side surfaces of the first gate dielectric film and the first gate electrode; a first source/drain region in the first active region outside the first side-wall dielectric film; a first silicide layer in a top-layer portion of the first source/drain region; a second side-wall dielectric film on the first silicide layer around a corner at which the side surface of the first side-wall dielectric film meets an upper surface of the first silicide layer; and a first stressor film for exerting a tensile stress on a channel region in a gate length direction, the first stressor film covering the first gate electrode, the first side-wall dielectric film, and the second side-wall dielectric film.
Public/Granted literature
- US20080128823A1 Semiconductor device and method for fabricating the same Public/Granted day:2008-06-05
Information query
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