Invention Grant
US07781867B2 Method and system for providing an aligned semiconductor assembly
有权
用于提供对准的半导体组件的方法和系统
- Patent Title: Method and system for providing an aligned semiconductor assembly
- Patent Title (中): 用于提供对准的半导体组件的方法和系统
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Application No.: US11966254Application Date: 2007-12-28
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Publication No.: US07781867B2Publication Date: 2010-08-24
- Inventor: Michael G. Lee
- Applicant: Michael G. Lee
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Baker Botts L.L.P.
- Main IPC: H01L29/06
- IPC: H01L29/06
Abstract:
A semiconductor assembly is provided that includes a first substrate that has a first surface. A second substrate is coupled to and spaced apart from the first substrate. The second substrate has a second surface facing the first surface of the first substrate. The second substrate includes a set of cavities. A set of non-conductive pillars is disposed on and protrudes from the first surface of the first substrate. The set of non-conductive pillars is configured and positioned to engage the set of cavities of the second substrate to align the second substrate with the first substrate.
Public/Granted literature
- US20090166857A1 Method and System for Providing an Aligned Semiconductor Assembly Public/Granted day:2009-07-02
Information query
IPC分类:
