Invention Grant
- Patent Title: Structure for reduction of soft error rates in integrated circuits
- Patent Title (中): 降低集成电路中软错误率的结构
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Application No.: US12483364Application Date: 2009-06-12
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Publication No.: US07781871B2Publication Date: 2010-08-24
- Inventor: Cyril Cabral, Jr. , Michael S. Gordon , Kenneth P. Rodbell
- Applicant: Cyril Cabral, Jr. , Michael S. Gordon , Kenneth P. Rodbell
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Schmeiser, Olsen & Watts
- Agent Louis J. Percello
- Main IPC: H01L23/552
- IPC: H01L23/552

Abstract:
A structure for reduction of soft error rates in integrated circuits. The structure including: a semiconductor substrate; and a stack of one or more wiring levels stacked from a lowermost wiring level to an uppermost wiring level, the lowermost wiring level nearer the semiconductor substrate than the uppermost wiring level; and an alpha particle blocking layer on a top surface of the uppermost wiring level of the one or more wiring levels, the blocking layer comprising metal wires and a dielectric material, the blocking layer having a combination of a thickness of the blocking layer and a volume percent of metal wires in the blocking layer sufficient to stop a predetermined percentage of alpha particles of a selected energy or less striking the blocking layer from penetrating into the stack of one or more wiring levels or the substrate.
Public/Granted literature
- US20090243053A1 STRUCTURE FOR REDUCTION OF SOFT ERROR RATES IN INTEGRATED CIRCUITS Public/Granted day:2009-10-01
Information query
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