Invention Grant
- Patent Title: Curing layers of a semiconductor product using electromagnetic fields
- Patent Title (中): 使用电磁场的半导体产品的固化层
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Application No.: US11741324Application Date: 2007-04-27
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Publication No.: US07781876B2Publication Date: 2010-08-24
- Inventor: Horst Theuss , Manfred Mengel , Joachim Mahler
- Applicant: Horst Theuss , Manfred Mengel , Joachim Mahler
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dickstein, Shapiro, LLP.
- Priority: DE102007017641 20070413
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A semiconductor product including a substrate, a semiconductor chip fitted to the substrate, and a layer, which contains coated particles, located adjacent to the semiconductor chip, wherein the coated particles have a ferromagnetic, ferrimagnetic or paramagnetic core and a coating.
Public/Granted literature
- US20080251904A1 CURING LAYERS OF A SEMICONDUCTOR PRODUCT USING ELECTROMAGNETIC FIELDS Public/Granted day:2008-10-16
Information query
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