Invention Grant
- Patent Title: Optoelectronic semiconductor package and method for attaching heat dissipation element thereto
- Patent Title (中): 光电子半导体封装及其散热元件的安装方法
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Application No.: US12114623Application Date: 2008-05-02
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Publication No.: US07781885B2Publication Date: 2010-08-24
- Inventor: Tai-Wei Lin , Chi-Chui Yun , Jia-Bin Huang , Zeu-Chia Tan , Wan-chen Lai
- Applicant: Tai-Wei Lin , Chi-Chui Yun , Jia-Bin Huang , Zeu-Chia Tan , Wan-chen Lai
- Applicant Address: TW Hsin-Chu
- Assignee: Young Optics Inc.
- Current Assignee: Young Optics Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW96130653A 20070820
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L21/00
Abstract:
An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.
Public/Granted literature
- US20090052483A1 OPTOELECTRONIC SEMICONDUCTOR PACKAGE AND METHOD FOR ATTACHING HEAT DISSIPATION ELEMENT THERETO Public/Granted day:2009-02-26
Information query
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