Invention Grant
US07781900B2 Semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the same
有权
包括壳体和部分地嵌入在塑料外壳组合物中的半导体芯片的半导体器件及其制造方法
- Patent Title: Semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the same
- Patent Title (中): 包括壳体和部分地嵌入在塑料外壳组合物中的半导体芯片的半导体器件及其制造方法
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Application No.: US11630930Application Date: 2005-06-09
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Publication No.: US07781900B2Publication Date: 2010-08-24
- Inventor: Manuel Carmona , Anton Legen , Ingo Wennemuth
- Applicant: Manuel Carmona , Anton Legen , Ingo Wennemuth
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102004031889 20040630
- International Application: PCT/DE2005/001040 WO 20050609
- International Announcement: WO2006/002606 WO 20060112
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/28
Abstract:
One aspect of the invention relates to a semiconductor device including a housing and a semiconductor chip partly embedded in a plastic housing composition. Another aspect relates to a method for producing the same. The plastic housing composition has at least one host component having a softening temperature and an incorporated component having a phase change temperature. In this case, the softening temperature of the host component is greater than the phase change temperature of the incorporated component.
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