Invention Grant
- Patent Title: SMD battery contact module
- Patent Title (中): SMD电池触点模块
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Application No.: US11810969Application Date: 2007-06-07
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Publication No.: US07782010B2Publication Date: 2010-08-24
- Inventor: Markus Heerlein , Thomas Kasztelan , Vincent Ong
- Applicant: Markus Heerlein , Thomas Kasztelan , Vincent Ong
- Applicant Address: DE Erlangen
- Assignee: Siemens Audiologische Technik GmbH
- Current Assignee: Siemens Audiologische Technik GmbH
- Current Assignee Address: DE Erlangen
- Priority: DE102006026753 20060608
- Main IPC: H02J7/00
- IPC: H02J7/00 ; H04R25/00

Abstract:
The production of hearing apparatuses and in particular of hearing devices is to be simplified. To this end, a battery contact module with an electrical contact facility and a plastic frame is proposed, to/in which the contact facility is fastened. In this way, the battery contact module is designed as a SMD component and the contact facility has corresponding connections for a surface mounting on a printed circuit board. An amplifier printed circuit board can herewith be advantageously automatically equipped with the battery contact module and soldered.
Public/Granted literature
- US20070293081A1 SMD battery contact module Public/Granted day:2007-12-20
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